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CMOS Mixed-Signal (Analog + Digital) Integrated Circuits Design for System-on-Chip (SOC) and System LSI
Communication-aware System-on-Chip (SOC), Network-on-chip (NOC), & System-in-Package (SIP) design
High-Speed & High-Performance CMOS I/O Interface Circuits & Systems
2.5D/3D Heterogeneous Integration (HI) Technology and Inter-Chiplet Communication Link PHY Technology
UCIe (Universal Chiplet Interconnect Express) and Tera-bps Silicon-Photonics Link PHY Technology
PCIe/DisplayPort/eDP/HDMI/LVDS/SATA/USB ICs
Signal integrity (SI) and power integrity (PI) for Chip-PKG-PCB co-design
Ultra low-power I/O interface for on-chip & board-level communications
Signaling and clocking technologies for Network-on-chip (NOC), HBM, and 3D-SOC
Ultra low-power memory circuits with ECC (Error Correction Code)
Power Management ICs (PMICs), LDOs, and Gate Driver ICs for GaN/SiC Power Transistors
Monolithically Integrated GaN DC-DC Power Converters
DC-DC Converter ICs for Data Centers, Automotives, and AMOLED Displays
화합물전력반도체 전문인력양성사업: (산업통상자원부/한국산업기술진흥원 2025.03~2030.02)
첨단산업 인재양성 부트캠프사업 (반도체): (교육부/한국산업기술진흥원 2024.03~2029.02)
고전압 GaN 기반 DC-DC Buck Converter 설계 (Fabless C사 2024.06~2024.12)
차세대반도체 불량분석및품질관리 전문인력양성 사업 (산업통상자원부/한국산업기술진흥원 2022.03~2027.02)
GaN 전력소자 및 모노리식 구동회로 기술 개발 (과기정통부 2022.04~2026.12)
차세대 Terahertz 통신-반도체 인력양성팀: 한국연구재단 두뇌한국21 BK21플러스사업 (교육부/한국연구재단 2020~2027)
초고속반도체 IC설계 및 테스트/신호무결성 전문인력양성사업: (교육부/산업통상자원부 2022.07~2025.2)
고속 클럭킹 기술 개발 (Fabless M사 2024.04~2024.06)
BCD 공정기반 GaN Driver IC 설계 (Fabless C사 2023.09~2024.02)
차세대 Tera-bps 집적 실리콘-포토닉스 링크 PHY 기술 (한국연구재단 중견연구 2019.03-2022.02)
10GHz Real-time Clock Jitter Reduction (삼성전자 2020-2021)
초 Slim/모듈型 전력/Data 동시 전송 시스템 개발 (삼성전자 2020-2021)